Applied Materials had six patents in connectivity during Q2 2024. The patents filed by Applied Materials Inc in Q2 2024 focus on electronic and photonic integrated circuits, specifically on methods for fabricating integrated interconnect between electrical, opto-electrical, and photonic devices. These methods enable high volume manufacturing of devices with optical structures like waveguides on a photonic glass layer substrate, allowing for the creation of co-packaged optical and electrical devices. GlobalData’s report on Applied Materials gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Applied Materials had no grants in connectivity as a theme in Q2 2024.
Recent Patents
Application: Methods for fabrication of optical structures on photonic glass layer substrates (Patent ID: US20240111107A1)
The patent filed by Applied Materials Inc. relates to methods for fabricating electronic and photonic devices, specifically focusing on integrated interconnects between electrical, opto-electrical, and photonic devices. The methods involve depositing core material layers on substrates with photonic glass layers, forming optical structures such as waveguides, and utilizing different refractive indexes for various layers to enable light transmission. The fabrication process includes steps like depositing cladding layers, encapsulation layers, and utilizing materials like Si3N4, SiO2, and various other compounds for the core material layer.
Additionally, the patent describes methods for forming chip mounting regions and fiber connectors on the substrate to connect integrated circuits and optical fiber cables, respectively. The core material layer can consist of a variety of materials like silicon carbide, titanium dioxide, and aluminum oxide, among others. The optical structures formed include waveguides that transmit light between different edges of the substrate, with varying cross-sectional dimensions. The fabrication process also involves ion implantation to introduce doping ions into the substrate to define optical structures with different refractive indexes. Overall, the patent details a comprehensive approach to manufacturing electronic and photonic devices with integrated interconnects, utilizing a combination of materials and fabrication techniques to enable efficient light transmission and connectivity.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
