Applied Materials had 93 patents in future of work during Q4 2023. The patents filed by Applied Materials Inc in Q4 2023 focus on methods and systems for controlling chemical mechanical polishing systems, selecting process recipes based on Pareto efficient parameters, adjusting operating parameters for material deposition on wafers, utilizing machine learning models for electronic device manufacturing, and implementing corrective actions based on trace data analysis for substrate processing systems. These innovations aim to improve efficiency, accuracy, and quality in semiconductor manufacturing processes. GlobalData’s report on Applied Materials gives a 360-degreee view of the company including its patenting strategy. Buy the report here.

Applied Materials grant share with future of work as a theme is 22% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Window logic for control of polishing process (Patent ID: US20230415302A1)

The patent filed by Applied Materials Inc. describes a method for controlling a chemical mechanical polishing system by receiving time-varying signals from an endpoint detection system for multiple test substrates, displaying these signals graphically, allowing user input to select specific signal ranges and boundary crossing logic functions, and using this information to determine the endpoint of the polishing process. The system monitors the device substrate during polishing, evaluates the signals based on selected logic functions, and makes endpoint determinations accordingly.

The method involves receiving signals from multiple test substrates, displaying them graphically, selecting signal ranges and logic functions, and using this information to determine the endpoint of the polishing process. By allowing user input for signal selection and logic function choice, the system provides a customizable approach to endpoint detection during chemical mechanical polishing. The algorithm used in the process identifies boundary crossing logic functions based on the signals received, ensuring accurate endpoint determinations for each substrate. This method enhances the efficiency and precision of chemical mechanical polishing systems by providing a systematic and user-friendly approach to endpoint detection.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.