Applied Optoelectronics has filed a patent for an optical transceiver housing with an integrated vapor chamber. The housing includes two portions forming a compartment, and the vapor chamber has a heat input side and a heat output side. The outer wall of one of the housing portions is defined by the heat output side of the vapor chamber, allowing for heat transfer from inside to outside the housing. GlobalData’s report on Applied Optoelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Applied Optoelectronics, Quantum key distribution was a key innovation area identified from patents. Applied Optoelectronics's grant share as of September 2023 was 63%. Grant share is based on the ratio of number of grants to total number of patents.

Optical transceiver housing with integrated vapor chamber for heat transfer

Source: United States Patent and Trademark Office (USPTO). Credit: Applied Optoelectronics Inc

A recently filed patent (Publication Number: US20230314736A1) describes a transceiver housing and an optical transceiver module with integrated vapor chambers for improved heat dissipation. The transceiver housing includes at least two housing portions on opposite sides, forming a compartment. At least one of the housing portions is integrated with a vapor chamber, which has a heat input side and a heat output side. The outer wall of the housing portion is defined, at least in part, by the heat output side of the vapor chamber, allowing heat to be exposed to the outside of the housing body.

The patent claims also describe various features of the transceiver housing and the optical transceiver module. The vapor chamber can be overmolded into the housing portion, and it can be made of heat conducting materials such as copper, aluminum, or titanium. The heat output side of the vapor chamber can have different elevations, allowing it to be positioned near heat generating components with different heights inside the transceiver housing. The heat transfer regions on the heat output side can have surface areas corresponding to the respective heat generating components.

In the case of the optical transceiver module, it includes a transceiver housing with a transceiver optical connection end and a transceiver electrical connection end. The housing accommodates a transmitter optical subassembly (TOSA) and a receiver optical subassembly (ROSA), both connected to a circuit board. The transceiver housing also integrates at least one vapor chamber, which is thermally coupled to heat generating components inside the module and has a heat output side exposed to the outside.

Overall, this patent aims to improve heat dissipation in transceiver housings and optical transceiver modules by integrating vapor chambers into the housing structure. By utilizing the heat output side of the vapor chamber as part of the outer wall, heat can be efficiently transferred to the outside environment. The use of different elevations and surface areas on the heat output side allows for effective positioning and distribution of heat near the heat generating components. These innovations have the potential to enhance the performance and reliability of transceiver devices by preventing overheating and maintaining optimal operating temperatures.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.