CEC Huada Electronic Design (HED) has launched China’s first 55nm smart card chip based on semiconductor foundry company SMIC’s 55nm LL (low leakage) eFlash platform.
The newly launched smart card chip, which has been put into mass production, is smaller in size, consumes lower power and offers faster performance.
SMIC claims that its 55nm LL eFlash platform has complete logic compatibility and all of its 1.2V logic library IPs can be applied to this embedded platform.
To extract maximum performance and reliability, Cu-BEoL (Back-end of Line) has been used which allows a higher electric current density in the existing design.
Also, the surface area of the chips has been reduced that allows the application of large flash memory possible.
HED general manager Dong Haoran said: "HED is committed to exploring new technologies and applications, such as 55nm analog circuit design and system design technologies, and 12" wafer testing and dicing technologies. The research results have been applied to product development and allow new products to be launched into market more quickly."