Infineon Technologies had one patents in 3D printing during Q2 2024. The patent filed by Infineon Technologies AG in Q2 2024 describes a semiconductor device with a conductive carrier, a semiconductor chip, and a layer stack containing multiple dielectric layers. The layer stack provides galvanic isolation between the chip and the carrier, with at least one dielectric layer coated with an electrically conductive material. GlobalData’s report on Infineon Technologies gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Infineon Technologies had no grants in 3D printing as a theme in Q2 2024.
Recent Patents
Application: Semiconductor devices with electrical insulation features and associated production methods (Patent ID: US20240153885A1)
The patent filed by Infineon Technologies AG describes a semiconductor device that includes an electrically conductive carrier, a semiconductor chip, and a layer stack with dielectric layers that galvanically isolate the chip and carrier. One of the dielectric layers is coated with an electrically conductive coating to reduce electric field strength in specific regions of the device. The coating can also function as an electrode for a capacitor, contributing to field strength reduction based on capacitance.
Additionally, the semiconductor device may feature an adhesive layer with an electrically conductive filler, a securing layer with industrial carbon black, and openings in the electrically conductive coating to prevent eddy currents. Another aspect involves a dielectric structure with elevations surrounding the semiconductor chip to enlarge the creepage path between the chip and carrier. The structure may include chamfered shielding or rib structures, with embedded electrically conductive layers forming capacitors to further reduce electric field strength and lengthen discharge paths. The method for producing the semiconductor device involves fabricating dielectric shells with depressions, mounting the chip in a shell, and placing it on the carrier for galvanic isolation. Additional steps may include forming depressions in the shell surface or coating it with an electrically conductive material.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
