Intel had 46 patents in connectivity during Q1 2024. Intel Corp’s patents in Q1 2024 cover a range of technologies, including utilizing conjugated polymers in integrated circuit packages, implementing license management solutions for software defined silicon products, pluggable optical connectors, network operation processing for 5G networks, and microelectronic assemblies with photonic integrated circuits. These innovations demonstrate Intel‘s commitment to advancing technology across various domains. GlobalData’s report on Intel gives a 360-degree view of the company including its patenting strategy. Buy the report here.

Intel grant share with connectivity as a theme is 26% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Methods and apparatus utilizing conjugated polymers in integrated circuit packages with glass substrates (Patent ID: US20240107784A1)

The patent filed by Intel Corp. discloses methods, apparatus, systems, and articles of manufacture utilizing conjugated polymers in integrated circuit packages with glass substrates. The integrated circuit package includes a glass substrate, a first electrode, an organic material containing a conjugated polymer or a metal-organic supramolecule, and a second electrode. The organic material is positioned between the first and second electrodes, with the first electrode located between the glass substrate and the organic material. The glass substrate may define a waveguide to direct light towards the organic material, and the organic material may possess photoactive or electrochromic properties.

Furthermore, the patent describes a method of manufacturing the integrated circuit package, involving shaping a glass substrate, depositing metal layers for electrodes, and depositing the organic material containing the conjugated polymer or metal-organic supramolecule. Various configurations and applications of the integrated circuit package are detailed in the claims, such as implementing a photodetector, optical filter, or photonic integrated circuit. The method may include techniques like spray coating, spin coating, or casting for depositing the organic material. Overall, the patent focuses on the integration of conjugated polymers in IC packages with glass substrates for optical and electronic applications.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.