Kyocera had ten patents in connectivity during Q4 2023. Kyocera Corp’s patents in Q4 2023 include an optical circuit board with a silicon photonics device mounted on a wiring board, a user equipment method for receiving synchronization signals and master information blocks from a base station, a base station transmitting rate recommendations for VoLTE calls to user equipment, and a method for user equipment transitioning between RRC connected, specific, and idle states in response to messages from a base station in a radio access network. GlobalData’s report on Kyocera gives a 360-degreee view of the company including its patenting strategy. Buy the report here.

Kyocera grant share with connectivity as a theme is 50% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Optical circuit board and electronic component mounting structure using same (Patent ID: US20230408777A1)

The patent filed by Kyocera Corp. describes an optical circuit board that includes a wiring board with a cavity separating a first region for a silicon photonics device and a second region with a first conductor layer. The optical waveguide on the first conductor layer has a core surrounded by claddings, with a portion of the first conductor layer protruding towards the first region above the cavity.

The claims detail specific features of the optical circuit board, such as the presence of an insulating layer with inorganic filler particles exposed in the cavity, a second conductor layer at the bottom of the cavity, and a method of manufacturing the board using an excimer laser. Additionally, the patent covers an electronic component mounting structure involving the optical circuit board, a silicon photonics device, and an electronic component, where the silicon waveguide of the device faces the core of the optical waveguide. These claims highlight the unique design and manufacturing process of the optical circuit board for efficient integration of silicon photonics devices and electronic components.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.