Lam Research had two patents in 3D printing during Q1 2024. The patent filed by Lam Research Corp in Q1 2024 relates to semiconductor-processing chamber components made using solid-state additive manufacturing. These components include a base with a metal matrix composite layer and a dielectric layer, providing improved performance and durability in semiconductor processing applications. GlobalData’s report on Lam Research gives a 360-degree view of the company including its patenting strategy. Buy the report here.

Lam Research had no grants in 3D printing as a theme in Q1 2024.

Recent Patents

Application: Processing parts using solid-state additive manufacturing (Patent ID: US20240062997A1)

The patent filed by Lam Research Corp. describes semiconductor-processing chamber components made using solid-state additive manufacturing (SSAM). These components include a base with a metallic material, a metal matrix composite (MMC) layer with metallic and non-metallic materials, and a dielectric layer directly on the MMC layer. The MMC layer is formed using SSAM, and the dielectric layer is made of non-metallic material. The components also feature a corrosion-protection layer and have specific coefficient of linear thermal expansion (CTE) values.

The patent further details a method for manufacturing these components, involving depositing the MMC layer on the base using SSAM and adding a dielectric layer on top. Before the MMC layer, a corrosion-protection layer can be added, and the dielectric layer can be made of various materials using air plasma spraying. The thickness of the MMC layer and dielectric layer falls within a specific range, and the components are designed with decreasing CTE values from the base to the dielectric layer. The method ensures the components are suitable for use in a processing chamber, providing enhanced performance and durability.

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