Lam Research had three patents in 3D printing during Q4 2023. Lam Research Corp has developed a method for 3D printing silicon components using a high-powered beam to melt powdered silicon, with options for fully dense printing and crack-free printing. They have also created a component for plasma processing chambers with a plasma-facing surface made of silicon doped with various materials or layers consisting of boron or tantalum. GlobalData’s report on Lam Research gives a 360-degreee view of the company including its patenting strategy. Buy the report here.

Lam Research grant share with 3D printing as a theme is 33% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Additive manufacturing of silicon components (Patent ID: US20230348311A1)

The patent filed by Lam Research Corp. describes a method for 3D printing silicon components using powdered silicon in a layer-by-layer process. The process involves forming a powder bed of silicon, melting the powdered silicon with a high-powered beam, and cooling the component at a predetermined rate. The method also includes using buffer layers of silicon on a steel substrate and employing heaters and thermal insulation to minimize temperature gradients during printing, annealing, and cooling for fully dense and crack-free components.

Additionally, the patent includes claims related to the method, such as using an electron beam for melting, performing the process in an inert gas environment, and utilizing silicon particles with specific size distributions and purities. The patent also covers various techniques for producing powdered silicon, adjusting particle morphology, and controlling temperature ramp rates. Furthermore, the patent describes a system for printing fully dense nonmetallic components, including silicon, using an electron beam and a powder dosing mechanism. The system also includes features for maintaining vacuum, selecting powder particle sizes, and vibrating meshes for powder selection. Overall, the patent outlines a comprehensive method and system for 3D printing fully dense and crack-free silicon components with specific parameters and techniques to achieve high-quality results.

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