Lam Research had 13 patents in future of work during Q2 2024. Lam Research Corp has filed patents for rotational indexers allowing wafer centering during transfer operations in a multi-station chamber, using movable rotational center axis and sealing arrangements. Another patent relates to a Mixed Reality control platform for operating semiconductor manufacturing tools, displaying data in an MR environment through sensor data transmission and rendering control features in an MR headset. GlobalData’s report on Lam Research gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Lam Research had no grants in future of work as a theme in Q2 2024.
Recent Patents
Application: Rotational indexers with wafer centering capability (Patent ID: US20240213070A1)
The patent filed by Lam Research Corp. describes rotational indexers that enable wafer centering during wafer pedestal-to-pedestal transfers in a multi-station chamber. One type of rotational indexer allows lateral movement of the rotational center axis for wafer centering, while another type uses additional rotational capability at the wafer supports combined with off-center placement of wafers for centering. The apparatus includes a chamber with semiconductor processing stations, a rotational indexer with a central hub and indexer arms, and a controller to select pedestals, rotate the hub and wafer supports, and center wafers for transfer operations.
The claims detail the specific functions of the apparatus, including selecting embarkation and destination pedestals, rotating the hub and wafer supports to center wafers, and lifting wafers off the supports. The apparatus can handle multiple wafers simultaneously, with instructions for rotation timing and wafer positioning. Additional features include using wafer position sensors, controlling lift pin mechanisms, and storing instructions for processor control. The patent also covers non-transitory, computer-readable media storing instructions for controlling the semiconductor processing tool, emphasizing wafer centering and transfer operations.
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