Lam Research had five patents in robotics during Q4 2023. Lam Research Corp filed a patent for a method of calibration involving detecting temperature-induced offsets in a process module pedestal, determining the magnitude and direction of the offset using entry and exit offsets. Another patent describes an edge ring centering system for a plasma processing system, including a processing chamber with a substrate support, edge ring lift pins, grooves on the edge ring, a robot arm with an end effector, and a controller for positioning the edge ring accurately on the lift pins. GlobalData’s report on Lam Research gives a 360-degreee view of the company including its patenting strategy. Buy the report here.

Lam Research grant share with robotics as a theme is 40% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Auto-calibration to a station of a process module that spins a wafer (Patent ID: US20230395410A1)

The patent filed by Lam Research Corp. describes a method for calibration in a process module by determining a temperature-induced offset in the pedestal. The method involves delivering a wafer to the pedestal, detecting entry and exit offsets, and calculating the magnitude and direction of the temperature-induced offset based on these measurements. The calibration process corrects for condition-induced offsets of the rotation axis of a rotation device within the process module, ensuring accurate processing of wafers.

Additionally, the patent outlines a system for processing that includes a process module with a rotation device, a pedestal, and a transfer module (TM) robot for handling wafers. The TM robot applies condition corrections to the wafers to account for rotation axis offsets under different conditions. A measurement system is used to determine entry and exit offsets of calibration wafers, allowing for the calculation of the conditioned-induced offset of the rotation axis. The system ensures precise alignment and processing of wafers within the process module, even under varying conditions like temperature or vacuum levels.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.