Qualcomm had 473 patents in artificial intelligence during Q1 2024. Qualcomm Inc’s patents in Q1 2024 include a package design with multiple chiplets and encapsulation layers, a bulk acoustic wave device with unique layer configurations for higher resonant frequencies, communication techniques for positioning using reference signals, user authentication using facial modeling parameters, and machine learning models for predicting object locations in a spatial environment. GlobalData’s report on Qualcomm gives a 360-degree view of the company including its patenting strategy. Buy the report here.

Qualcomm grant share with artificial intelligence as a theme is 14% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Package comprising an integrated device, a chiplet and a metallization portion (Patent ID: US20240105688A1)

The patent filed by Qualcomm Inc. describes a package design that includes a substrate with interconnects, multiple chiplets, an encapsulation layer, encapsulation interconnects, and a metallization portion, all coupled together to form a package. The package also includes integrated devices and through substrate vias in the chiplets, allowing for efficient electrical paths within the package. Additional chiplets and components like deep trench capacitors can be added to the package for enhanced functionality and performance.

The package design allows for flexible configurations with multiple chiplets and integrated devices, interconnected through various solder and encapsulation interconnects. The chiplets can be coupled to a power distribution network, providing power-efficient operation. The package is suitable for a wide range of devices, from mobile phones and tablets to servers and automotive vehicles, showcasing its versatility and potential applications across different industries. The design emphasizes efficient interconnectivity and integration of components within the package, enabling high performance and functionality in a compact form factor.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.