Semtech has been granted a patent for a semiconductor device that allows for stacking multiple semiconductor dies with protection circuits to increase ESD current discharge capability. The device features TVS diodes coupled in parallel to protect against transient electrical signals. The innovative design enhances protection for semiconductor packages. GlobalData’s report on Semtech gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Semtech, Adaptive video coding was a key innovation area identified from patents. Semtech's grant share as of January 2024 was 53%. Grant share is based on the ratio of number of grants to total number of patents.

Semiconductor device with stacked protection circuits for esd discharge

Source: United States Patent and Trademark Office (USPTO). Credit: Semtech Corp

A recently granted patent (Publication Number: US11881476B2) discloses a semiconductor device designed to protect a separate semiconductor package from transient electrical signals. The device comprises a leadframe, with a first semiconductor die containing a transient voltage suppression (TVS) diode placed over it. A second semiconductor die, also with a TVS diode, is positioned over the first die, with both diodes connected in parallel between the leadframe's terminals. An encapsulant covers the dies and leadframe, ensuring the transient signal is routed through the diodes for protection.

Additionally, the semiconductor device includes features such as conductive bumps for bonding the dies, conductive vias for electrical connections, and thermocompression bonding between the dies. The device can have exactly two terminals and may include multiple semiconductor dies with corresponding TVS diodes for enhanced protection. The configuration of the semiconductor device allows for efficient protection against transient voltages, with the diodes working in parallel to safeguard the connected semiconductor package. The use of solder bumps and encapsulation further enhances the device's durability and reliability in real-world applications, making it a valuable innovation in the field of semiconductor protection technology.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.