Texas Instruments patented a sensor device with two MEM structures, each containing heating and temperature sensing elements. The structures are thermally and mechanically isolated from the substrate. An amplifier circuit processes the output signals from the thermal converters. GlobalData’s report on Texas Instruments gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Texas Instruments, Under-screen biometric identification was a key innovation area identified from patents. Texas Instruments's grant share as of January 2024 was 67%. Grant share is based on the ratio of number of grants to total number of patents.

Sensor circuit package with mem structures for temperature sensing

Source: United States Patent and Trademark Office (USPTO). Credit: Texas Instruments Inc

A sensor circuit package, as described in the granted patent US11884538B2, includes at least two Micro-Electro-Mechanical (MEM) structures. Each MEM structure consists of a central core region with a thermal converter circuit that heats the core region in response to a signal, providing a temperature signal. The support structure isolates the core region thermally and mechanically from the bulk substrate base layer. An amplifier circuit processes the output signals from the thermal converters to generate an amplifier signal. The package allows for galvanic isolation between input and output terminals, enhancing the accuracy of temperature sensing and signal processing.

Furthermore, the sensor circuit package features temperature sensing elements like diodes, thermistors, transistors, or thermocouples within the MEM structures. The amplifier drives current to the heating element based on temperature readings from different sensing elements, ensuring the output signal represents the root mean square value of the input signal. The design includes support arms, substrate layers, insulating layers, and passivation layers to enhance the functionality and reliability of the MEM structures. Additionally, a lead frame with terminals connected to the amplifier and thermal converters facilitates efficient signal transmission and processing within the sensor circuit package, making it a comprehensive solution for accurate temperature sensing and signal amplification in various applications.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.