Tokyo Electron. has filed a patent for a substrate support in a plasma processing apparatus. The support includes a ceramic base, an electrostatic chuck with central and annular regions, and a coating layer. Electrodes consist of first and second metal layers. The design aims to enhance substrate processing efficiency. GlobalData’s report on Tokyo Electron gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Tokyo Electron, 3D memory devices was a key innovation area identified from patents. Tokyo Electron's grant share as of January 2024 was 44%. Grant share is based on the ratio of number of grants to total number of patents.
Substrate support for plasma processing apparatus with electrostatic chuck
The patent application (Publication Number: US20240038507A1) discloses a substrate support for use in a plasma processing apparatus. The substrate support includes a base made of ceramic, an electrostatic chuck, and a plurality of electrodes. The electrostatic chuck has a central region for supporting a substrate, an annular region for supporting an edge ring, and a coating layer on its surface. The electrodes consist of multiple metal layers positioned between different regions of the electrostatic chuck and the base. Additionally, the substrate support features power feed lines extending through holes in the base, connected to the electrodes to provide power.
Furthermore, the patent application describes a plasma processing apparatus incorporating the substrate support within a plasma processing chamber. The substrate support includes a base with distinct central and peripheral portions, an electrostatic chuck, a metal layer connecting different regions of the base, and an insulating film. This configuration allows for efficient plasma processing of substrates within the chamber. The apparatus offers improved support for substrates during processing, enhancing overall performance and reliability in plasma processing applications.
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