Tokyo Electron has been granted a patent for a plasma processing apparatus with a unique substrate support design. The apparatus includes a wafer placement surface, ring placement surface for two rings, a lifter pin with two holding portions, and a driving mechanism for raising and lowering the lifter pin. GlobalData’s report on Tokyo Electron gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Tokyo Electron, 3D memory devices was a key innovation area identified from patents. Tokyo Electron's grant share as of April 2024 was 59%. Grant share is based on the ratio of number of grants to total number of patents.
Plasma processing apparatus with lifter pin for wafer support
A recently granted patent (Publication Number: US11972933B2) discloses a plasma processing apparatus and a substrate support designed for efficient wafer processing. The apparatus includes a wafer placement surface and a ring placement surface for accommodating two rings without overlapping vertically. A lifter pin with two holding portions is utilized, along with a driving mechanism to raise and lower the lifter pin as needed for the processing operation.
The substrate support of the plasma processing apparatus features a unique design with a lifter pin that can be rotated and positioned at different heights for transferring rings during the processing. The driving mechanism allows for precise control over the lifter pin's position, enabling the transfer of the first and second rings at varying heights. Additionally, the substrate support includes a ring electrostatic chuck and a gas supply mechanism for enhanced functionality during the processing operation. Overall, the patented technology aims to improve the efficiency and effectiveness of plasma processing operations in semiconductor manufacturing.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
