Vishay Intertechnology has patented a method for creating multi-thickness electro-magnetic devices using various processes like extrusion, skiving, or 3D printing. The devices have conductive elements with varying thicknesses for improved performance. GlobalData’s report on Vishay Intertechnology gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Vishay Intertechnology, 3D memory devices was a key innovation area identified from patents. Vishay Intertechnology's grant share as of April 2024 was 60%. Grant share is based on the ratio of number of grants to total number of patents.

Multi-thickness electro-magnetic devices with conductive elements and leads

Source: United States Patent and Trademark Office (USPTO). Credit: Vishay Intertechnology Inc

A recently granted patent (Publication Number: US11948724B2) discloses a method for producing a multi-thickness electro-magnetic device. The method involves providing a conductive material and forming it into a multi-thickness sheet through processes like extrusion, skiving, or flattening. This sheet consists of different thickness portions, with one portion for the conductive element, another for the first lead portion, and a third for the second lead portion. The method ensures that the thickness of the conductive element is greater than that of the lead portions, with specific shapes like serpentine, rectangular, I-shape, H-shape, or barbell shape for the conductive element.

Furthermore, the method includes steps for creating a multi-thickness template by forming the sheet into the desired components and then pressing a core material around them to form the final body of the electro-magnetic device. Additional steps involve trimming the lead portions, positioning them on the body's surfaces, and plating the sheet or template with nickel or tin. The patent emphasizes the uniform thickness of the lead portions, the absence of overlapping elements, and the use of a continuous piece of conductive material for the components. Overall, this patented method offers a systematic approach to manufacturing multi-thickness electro-magnetic devices with specific design characteristics and structural integrity.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.