Applied Materials has filed a patent for a method of manufacturing a dielectric barrier discharge (DBD) structure. The method involves forming a patterned electrode layer around the outer perimeter of a substrate made of a dielectric material. Multiple electrodes and gaps between them are included in the patterned electrode layer. A dielectric layer is then deposited over at least a first region of the patterned electrode layer to create a DBD region in the structure. GlobalData’s report on Applied Materials gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Method of manufacturing a dielectric barrier discharge (dbd) structure
A recently filed patent (Publication Number: US20230319971A1) describes a method for manufacturing a dielectric barrier discharge (DBD) structure. The method involves several steps to create the DBD structure, which is used in various applications such as plasma generation, surface treatment, and gas sensing.
The first step of the method is to form a patterned electrode layer around the outer perimeter of a substrate made of a dielectric material. This patterned electrode layer consists of multiple electrodes with gaps between them. Next, a dielectric layer is deposited over at least a first region of the patterned electrode layer, creating the DBD region of the structure.
In addition to the above steps, the method can include positioning a dielectric sleeve over a second region of the patterned electrode layer to form an insulating region of the DBD structure. The dielectric sleeve has a greater thickness than the dielectric layer. A gap filler is then applied to fill any gap between the dielectric sleeve and the substrate, bonding them together.
The patent also describes various parameters and processes involved in the manufacturing method. For example, the thickness of the patterned electrode layer can range from approximately 0.1 microns to 20 microns, while the dielectric layer can be between approximately 25 and 1000 microns thick. The electrode layer can be formed by depositing an electrically conductive material on the substrate and then patterning it to create the patterned electrode layer.
Different processes can be used for patterning the electrode layer, such as machining, laser etching, or depositing a mask layer and etching the exposed portions of the electrode layer. The electrically conductive material used can be a metal, metal alloy, conductive oxide, or conductive ceramic, including materials like Cr, Ni, Au, Cu, Ag, Pd, Pt, ITO, TiN, TiB2, MoSi2, BaTiO3, Fe2O3, TiO3, ReO3, RuO2, IrO2, TiO, or V2O3.
The patent also covers additional steps like roughening the substrate's surface, performing a metallization process, depositing a metal oxide layer, and using different dielectric materials. The shape of the substrate can vary, and the gaps between the electrodes can have sizes ranging from 0.5 mm to 8 mm.
Another method described in the patent involves roughening or smoothing the surface of a dielectric rod, depositing an electrode layer, creating gaps in the electrode layer, and depositing a dielectric layer to form the DBD region.
Overall, this patent presents a detailed method for manufacturing a dielectric barrier discharge structure, providing potential advancements in various industries that utilize DBD technology.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
