BE Semiconductor Industries has been granted a patent for an apparatus that mounts components on a substrate. The device includes a bond head with a component gripper, drive systems for movement, cameras for positioning, and reference marks for accuracy. The invention aims to improve component mounting efficiency and precision. GlobalData’s report on BE Semiconductor Industries gives a 360-degree view of the company including its patenting strategy. Buy the report here.
Smarter leaders trust GlobalData
According to GlobalData’s company profile on BE Semiconductor Industries, was a key innovation area identified from patents. BE Semiconductor Industries's grant share as of February 2024 was 62%. Grant share is based on the ratio of number of grants to total number of patents.
Apparatus for mounting components on a substrate
A recently granted patent (Publication Number: US11924974B2) discloses an apparatus designed for mounting components on a substrate. The apparatus includes a bond head with a component gripper, reference marks, a feeding unit for supplying components, a substrate device, drive systems for moving the carrier and bond head, a drive for rotating the component gripper, substrate and component cameras, and optical deflection systems. The apparatus allows for precise positioning of components on the substrate by ensuring that reference marks and components are within the field of view of the cameras, enabling the detection of the actual position of the component in relation to the reference marks. Additionally, the apparatus features a system for reducing the distance between the component and substrate to ensure accurate placement.
Furthermore, the patent details various configurations and additional features of the apparatus, such as correction movements of the bond head, closed-loop axis of motion formed by the substrate camera, drive systems, and rotary drive, as well as the ability to allow movements of the substrate. The apparatus also includes options for attaching the component cameras to the carrier, enabling them to be movable or swivelable relative to the bond head. Overall, the apparatus described in the patent aims to enhance the precision and efficiency of mounting components on substrates by incorporating advanced camera systems, drive mechanisms, and positioning capabilities to ensure accurate placement of components during the assembly process.
To know more about GlobalData’s detailed insights on BE Semiconductor Industries, buy the report here.
Premium Insights
From
The gold standard of business intelligence.
Blending expert knowledge with cutting-edge technology, GlobalData’s unrivalled proprietary data will enable you to decode what’s happening in your market. You can make better informed decisions and gain a future-proof advantage over your competitors.
GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
