Broadcom. has filed a patent for a semiconductor device with a unique interconnection structure between the package substrate and PCB. The device includes posts with solder anchor portions and solder balls forming conductive interconnects. This innovation aims to enhance semiconductor packaging efficiency and performance. GlobalData’s report on Broadcom gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Broadcom, Digital watermarking was a key innovation area identified from patents. Broadcom's grant share as of January 2024 was 75%. Grant share is based on the ratio of number of grants to total number of patents.

Semiconductor device with novel interconnection structure between substrate and pcb

Source: United States Patent and Trademark Office (USPTO). Credit: Broadcom Inc

The patent application (Publication Number: US20240038645A1) describes a semiconductor device comprising a package substrate with multiple layers, a plurality of posts with solder anchor portions, and solder balls forming conductive interconnects between the package substrate and a printed circuit board (PCB) device. The conductive points on the package substrate are connected to the posts, which are then linked to corresponding contact points on the PCB. The posts are formed using semiconductor package manufacturing processes and can extend through multiple substrate layers, maintaining a continuous cross-section without geometrical transitions exceeding a certain proportion of the width.

Furthermore, the method described in the patent involves forming posts on the package substrate, adding solder anchor portions, and creating solder balls for interconnects. The process includes forming openings in the substrate layers, affixing posts to conductive pads, and applying solder anchor portions. The height of the posts is determined based on the heights of contact points on the PCB, ensuring optimal interconnection without relying solely on substrate warpage. The method also includes wire bonding processes and solder reflow techniques to create the solder balls efficiently. Overall, the patent application outlines a novel approach to semiconductor device manufacturing, emphasizing precise interconnects and efficient processes for optimal performance.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.