Canon had 24 patents in advanced materials during Q1 2024. Canon Inc filed patents in Q1 2024 for a liquid ejection head design with reference marks for alignment, a nanofabrication method for precise drop dispensing, a liquid ejection head for suction and wipe operations with low drive voltage, and a manufacturing method for a liquid ejection unit with improved electrical connections and sealing. GlobalData’s report on Canon gives a 360-degree view of the company including its patenting strategy. Buy the report here.
Canon grant share with advanced materials as a theme is 29% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Liquid ejection head and process for producing liquid ejection head (Patent ID: US20240092080A1)
The liquid ejection head described in the patent includes a base plate with multiple device chips containing ejection ports for liquid. Reference marks are provided on the base plate and device chips to ensure alignment along an array axis. The liquid ejection unit consists of a polygonal shape with at least five corners, including sides offset from each other in different directions, ensuring a specific layout for efficient liquid ejection.
Additionally, the patent details the composition of the ejection port forming member, which includes inorganic materials like Si, SiC, or SiO. The configuration of the sides of the liquid ejection unit and the overlap of certain portions are specified to optimize the design for liquid ejection. The patent also covers the sealing of electrical connecting portions with a sealing agent and the inclusion of a base plate with a liquid flow path for supplying liquid to the piezoelectric element. Furthermore, the liquid ejection head consists of multiple liquid ejection units arranged in an array direction, each with a polygonal shape and specific layout to ensure efficient liquid ejection.
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