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Amplitude gets grant for laser cutting dielectric or semiconductor materials with bursts of pulses
Amplitude has patented a method for laser cutting dielectric or semiconductor materials using bursts of femtosecond laser pulses. By spatially...
Amplitude gets grant for laser cutting method for dielectric or semiconductor materials
Amplitude has patented a method for laser cutting dielectric or semiconductor materials using bursts of femtosecond laser pulses. By spatially...