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Showing 4 results out of 4
Powertech Technology gets grant for package structure with chip, control element, and underfill
Powertech Technology has patented a package structure with a base, chip, control element, and underfill. The chip has a recess...
Powertech Technology gets grant for packaging structure with multiple dies and optical signal transmission
Powertech Technology's patent involves a packaging structure with multiple dies, an encapsulant, circuit structure, and filler. The design allows for...
Powertech Technology gets grant for package structure with encapsulated die, circuit structures, and filler
Powertech Technology has been granted a patent for a package structure that includes a first die, encapsulant, circuit structures, conductive...
Powertech Technology files patent for package device with conductive pillars, bridge chip, and active chips
Powertech Technology has filed a patent for a package device and its manufacturing method. The device includes a substrate, conductive...