Data Insights
![](/wp-content/plugins/wpsolr-pro-gd/wpsolr/core/images/gif-load.gif)
Sumco gets grant for semiconductor wafer evaluation method for chamfered surface boundary shape
Sumco's patented method evaluates semiconductor wafers by analyzing reflection and scattered light images to determine the distance between bright zones....
Sumco gets grant for manufacturing method of monocrystalline silicon using convection pattern estimation
Sumco's patent involves a method for estimating convection patterns in a silicon melt using a horizontal magnetic field, aiding in...
Sumco gets grant for method for evaluating cleanliness of silicon carbide surface
Sumco patented a method to evaluate cleanliness of silicon carbide surfaces. The process involves using a mixed acid, concentrating it,...
Sumco gets patent grant on double-sided polishing method for wafers using inclined carriers
Sumco has been granted a patent for a double-sided polishing method for wafers. The method involves measuring the inclination value...
Sumco files patent for method of producing epitaxial silicon wafer using cluster ion beam
Sumco has filed a patent for a method of producing epitaxial silicon wafers. The method involves irradiating the surface of...