IBIDEN. has filed a patent for a printed wiring board with a unique design. The board includes an insulating layer, conductor layer, adhesive layer, and resin insulating layer. The conductor layer has a specific roughness to improve performance. GlobalData’s report on IBIDEN gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on IBIDEN, Diesel Particulate Filters (DPF) was a key innovation area identified from patents. IBIDEN's grant share as of January 2024 was 27%. Grant share is based on the ratio of number of grants to total number of patents.
Printed wiring board with conductor layer having specific roughness
The patent application (Publication Number: US20240040692A1) describes a printed wiring board with specific features aimed at improving its performance. The board includes an insulating layer, a conductor layer with a defined roughness, an adhesive layer covering the conductor layer, and a resin insulating layer. The conductor layer's upper surface is designed to have a root mean square roughness Rq of 0.23 µm or less, ensuring optimal performance.
Furthermore, the adhesive layer on the printed wiring board is specifically designed to follow the unevenness of the conductor layer's upper surface. The adhesive layer includes a smooth film portion with a uniform thickness and a protruding part that enhances the overall structure. The patent application outlines various parameters for the adhesive layer, such as the height of the protruding part and the ratio of exposed smooth film portion to the total area of the adhesive layer. These features aim to enhance the functionality and reliability of the printed wiring board, making it suitable for various applications in the electronics industry.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
