Kyocera. has filed a patent for a printed wiring board with a dielectric layer, first and second conductor layers, and via conductors connecting them. The via conductors have an aspect ratio greater than 1 and are arranged in a line, with one connecting them along the periphery. GlobalData’s report on Kyocera gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Kyocera, Under-screen biometric identification was a key innovation area identified from patents. Kyocera's grant share as of January 2024 was 33%. Grant share is based on the ratio of number of grants to total number of patents.

Printed wiring board with high aspect ratio via conductors

Source: United States Patent and Trademark Office (USPTO). Credit: Kyocera Corp

The patent application (Publication Number: US20240040693A1) describes a printed wiring board with unique features. The board includes a dielectric layer with first and second conductor layers on opposite surfaces, connected by a plurality of via conductors. These via conductors have an aspect ratio greater than 1, with a major axis in one direction and a minor axis in another. Additionally, the board may include a third conductor layer between the first and second layers, with via conductors arranged side by side and in contact with the third layer in specific portions.

Furthermore, the patent application extends to a multilayer resonator and filter based on the printed wiring board design. The resonator includes the same dielectric and conductor layers connected by via conductors with specific orientations and arrangements. The filter, in turn, utilizes the resonator's structure to achieve desired filtering capabilities. Overall, the patent application showcases innovative designs for printed wiring boards, resonators, and filters that could potentially enhance performance and efficiency in various electronic applications.

To know more about GlobalData’s detailed insights on Kyocera, buy the report here.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.