Oki Electric Industry has filed a patent for a piezoelectric-body film joint substrate. The substrate includes a substrate electrode, a first piezoelectric film with a first upper electrode film, and a second piezoelectric film with a second upper electrode film. The patent aims to improve the performance and functionality of piezoelectric devices. GlobalData’s report on Oki Electric Industry gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Oki Electric Industry, Virtual banking assistant was a key innovation area identified from patents. Oki Electric Industry's grant share as of September 2023 was 23%. Grant share is based on the ratio of number of grants to total number of patents.
Piezoelectric-body film joint substrate
A recently filed patent (Publication Number: US20230320217A1) describes a piezoelectric-body film joint substrate and a method for manufacturing it. The substrate consists of a substrate electrode, a first piezoelectric-body film, and a second piezoelectric-body film. The first piezoelectric-body film includes a first piezoelectric film and a first upper electrode film, while the second piezoelectric-body film includes a second piezoelectric film and a second upper electrode film.
The patent claims that the area of the first and second piezoelectric-body films can differ from each other, with the area of the second film being smaller than the first. Additionally, the second piezoelectric-body film may include a second lower electrode film on the opposite side of the second upper electrode film. Similarly, the first piezoelectric-body film may include a first lower electrode film on the opposite side of the first upper electrode film.
The patent also states that the second piezoelectric film is monocrystalline, as is the first piezoelectric film. Furthermore, the area of the substrate electrode's surface is larger than the sticking surface of the first piezoelectric-body film.
The method for manufacturing the piezoelectric-body film joint substrate involves peeling off the first and second piezoelectric-body films from their respective substrates. The first film is then stuck onto an electrode formed on a third substrate, which is different from the first two substrates. Finally, the second piezoelectric-body film is stuck onto the first piezoelectric-body film.
Similar to the substrate, the method allows for the inclusion of a second lower electrode film on the second piezoelectric film and a first lower electrode film on the first piezoelectric film. The second piezoelectric film is also monocrystalline, just like the first. Additionally, the surface area of the electrode on the third substrate is larger than the sticking surface of the first piezoelectric-body film.
In summary, this patent describes a piezoelectric-body film joint substrate and a method for manufacturing it. The substrate consists of two piezoelectric-body films with different areas, and the method involves peeling off and sticking these films onto a third substrate. The patent also mentions the inclusion of lower electrode films and the use of monocrystalline piezoelectric films.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
