Qisda has filed a patent for an electronic device with a detachable element and a deformable enclosure. The device includes a pressure channel that, when in a negative pressure state, causes the deformable enclosure to exhibit a first deformation state and not contact the sensing element. When the pressure channel is not in a negative pressure state, the deformable enclosure exhibits a second deformation state and contacts the sensing element. GlobalData’s report on Qisda gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Qisda, drone gimbals was a key innovation area identified from patents. Qisda's grant share as of September 2023 was 54%. Grant share is based on the ratio of number of grants to total number of patents.
An electronic device with a deformable enclosure and pressure channel
A recently filed patent (Publication Number: US20230306144A1) describes an electronic device with a unique design that includes a body with two surfaces, a detachable element, a motherboard, and at least one deformable enclosure. The body of the device is formed with at least one pressure channel that penetrates either the first or second surface. The detachable element covers one end of the pressure channel, while the motherboard is arranged on the body and includes at least one sensing element. The deformable enclosure closes the other end of the pressure channel.
When the pressure channel is in a negative pressure state, the deformable enclosure exhibits a first deformation state where it does not contact the sensing element. However, when the pressure channel is not in a negative pressure state, the deformable enclosure exhibits a second deformation state where it contacts the sensing element. This design allows for different states of deformation based on the pressure within the channel.
The patent also describes the use of a metal sheet as the deformable enclosure, which includes a central area corresponding to the pressure channel and a peripheral area fixed to a supporting member. In the first deformation state, the central area is recessed towards the end of the pressure channel and does not contact the sensing element. In the second deformation state, the central area is flat and contacts the sensing element.
The patent further mentions the presence of a security circuit on the motherboard, which is electrically connected to the sensing element. When the deformable enclosure contacts the sensing element, the security circuit is in a connected state. This suggests that the device may have security features that are activated when the pressure channel is not in a negative pressure state.
In another embodiment of the electronic device described in the patent, the body consists of a front casing and a rear casing that can be covered with each other. The rear casing is formed with at least one pressure channel, and the first end of the pressure channel does not penetrate the rear casing. The motherboard is arranged between the front and rear casings and includes at least one sensing element and at least one supporting member. The deformable enclosure is fixed between the supporting member and the pressure channel, closing the second end of the pressure channel.
Overall, this patent describes an electronic device with a unique design that utilizes pressure channels and deformable enclosures to achieve different deformation states based on the pressure within the channels. The device may also include security features that are activated when the pressure channel is not in a negative pressure state.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
