Rockley Photonics has been granted a patent for a silicon integrated circuit. The circuit includes conductive traces and dielectric layers, with a method for fabrication involving etching openings, forming conductive layers, and removing excess material. GlobalData’s report on Rockley Photonics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Rockley Photonics, was a key innovation area identified from patents. Rockley Photonics's grant share as of February 2024 was 45%. Grant share is based on the ratio of number of grants to total number of patents.
Silicon integrated circuit fabrication method
A recently granted patent (Publication Number: US11923327B2) discloses a method for fabricating a silicon integrated circuit. The method involves various steps such as etching openings into a dielectric layer, forming conductive layers, and removing portions of the second conductive layer in specific regions. Additional features include the formation of wire bond pads and under bump metallization capture pads on the first conductive layer, enhancing the functionality and connectivity of the integrated circuit.
Furthermore, the patent claims cover the composition of the conductive layers, with materials such as aluminum, copper, gold, and various alloys being utilized. The integrated circuit fabricated using this method includes conductive traces, dielectric layers, and under bump metallization capture pads, all interconnected through vias. The materials used for the conductive traces and the under bump metallization capture pads are specified, ensuring the reliability and performance of the silicon integrated circuit. Overall, the patent highlights a comprehensive method for fabricating silicon integrated circuits with specific features and materials, aiming to improve the efficiency and functionality of such electronic devices.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
