Semtech. has filed a patent for a method of making a leadframe by chemically half-etching a conductive sheet to expose a contact surface, plating it with a solder wettable layer, and depositing an encapsulant. The process ensures precise formation of the leadframe for electronic components. GlobalData’s report on Semtech gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Semtech, Adaptive video coding was a key innovation area identified from patents. Semtech's grant share as of January 2024 was 53%. Grant share is based on the ratio of number of grants to total number of patents.
Method of making a leadframe by half-etching conductive material
The patent application (Publication Number: US20240021504A1) describes a method for making a leadframe using a sheet of conductive material. The method involves half-etching the sheet to create specific areas, including first and second half-etched areas. The first surface of the sheet is half-etched to form a first contact with a side surface exposed within the area, while the second surface is half-etched to create an opening through the sheet. Additional steps include plating a solder wettable layer over the contact surfaces and forming a support structure within the leadframe.
Furthermore, the patent application details a method for making a semiconductor device using the leadframe created through chemical half-etching. This process exposes the side surface of a contact, allowing for the plating of a solder wettable layer. The method also involves depositing an encapsulant over the leadframe and forming a dambar between contacts. The leadframe itself is described as having specific features, such as multiple half-etched areas with exposed contact surfaces and a support structure between contacts. The leadframe design allows for efficient manufacturing and assembly of semiconductor devices.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
