Shinko Electric Industries has patented a semiconductor device with a lead frame, wiring substrate, electronic component, connection member, and encapsulating resin. The lead frame features specific surface configurations for improved functionality. GlobalData’s report on Shinko Electric Industries gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Shinko Electric Industries, was a key innovation area identified from patents. Shinko Electric Industries's grant share as of February 2024 was 50%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor device with lead frame and encapsulating resin
A recently granted patent (Publication Number: US11929342B2) discloses a semiconductor device comprising a lead frame, a wiring substrate, an electronic component, a connection member, and an encapsulating resin. The lead frame includes a lead with specific surface configurations, such as a first surface covered by the encapsulating resin, a second surface with a step, and exposed end surfaces. The device also includes a heat sink with a heat sink first surface opposed to the electronic component, and a heat transmitting member sandwiched between the heat sink and the electronic component. The lead frame may include multiple leads with even thicknesses connected to the connection member.
Furthermore, the semiconductor device described in the patent includes various configurations and features to enhance its performance and functionality. These include the use of plated layers, oxide films, solder bumps for connecting the electronic component to the wiring substrate, and specific shapes and sizes for the lead and connection member. The design also ensures that surfaces of the lead, encapsulating resin, and wiring substrate are flush with each other, providing a compact and efficient structure. Additionally, the patent details different embodiments of the connection member, such as pillar-shaped or spherical core with solder, to facilitate the connection between the lead frame and the wiring substrate. Overall, the patented semiconductor device offers a novel and improved design for efficient electronic component packaging and connection within a lead frame and wiring substrate configuration.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
