Siltronic has been granted a patent for a method to produce semiconductor wafers of monocrystalline silicon. The process involves pulling a silicon crystal from a melt, subjecting it to a magnetic field, and rotating the crucible at a low speed with direction changes. The resulting wafers have low oxygen concentration. GlobalData’s report on Siltronic gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Siltronic, was a key innovation area identified from patents. Siltronic's grant share as of February 2024 was 38%. Grant share is based on the ratio of number of grants to total number of patents.

Method for producing monocrystalline silicon semiconductor wafers

Source: United States Patent and Trademark Office (USPTO). Credit: Siltronic AG

A recently granted patent (Publication Number: US11905617B2) discloses a method for producing semiconductor wafers of monocrystalline silicon. The method involves pulling a cylindrical section of a single silicon crystal from a melt contained in a crucible, with an oxygen concentration not exceeding 5×1017 atoms/cm3. The process includes subjecting the melt to a horizontal magnetic field, rotating the crucible at a rotational velocity of less than 1 rpm, and continually changing the rotational direction. The semiconductor wafers are then removed from the cylindrical section of the single crystal, ensuring the amplitude of the rotational velocity before and after the change in direction falls between 0.5 rpm and 3.0 rpm.

Furthermore, the patent claims specify that the rotational direction should be changed periodically with a period length ranging from 10 seconds to 100 seconds. Additionally, the amount of rotational velocity, averaged over time, should not exceed 0.7 rpm. These specific parameters and conditions outlined in the patent aim to optimize the production process of semiconductor wafers of monocrystalline silicon, ensuring high quality and efficiency in the manufacturing of these essential components for various electronic devices. The innovative method described in the patent highlights a novel approach to semiconductor wafer production, potentially offering advancements in the semiconductor industry.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.