STMicroelectronics has filed a patent for a power module packaged in a housing with a carrying substrate and multiple connection regions. An electronic component is attached to one of the connection regions, and an electrical connector extends from the component towards the surface of the housing. The connector is accessible from outside and includes a groove. GlobalData’s report on STMicroelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on STMicroelectronics, quantum dot devices was a key innovation area identified from patents. STMicroelectronics's grant share as of September 2023 was 67%. Grant share is based on the ratio of number of grants to total number of patents.
Power module with embedded electrical connector
A recently filed patent (Publication Number: US20230317537A1) describes a power module with unique features. The power module includes a housing with a main surface and lateral surfaces. Inside the housing, there is a carrying substrate that forms multiple connection regions made of conductive material. An electronic component is attached to one of these connection regions. Additionally, there is an electrical connector that is coupled to either the electronic component or another connection region. The electrical connector extends towards the main surface of the housing and is transverse to it. It is also accessible from the outside of the housing and includes a groove that extends into the connector.
The patent also describes an assembling method for the power module. The method involves attaching the electronic component to a connection region of the carrying substrate and attaching the electrical connector, which includes a pillar element with a groove, to either the electronic component or another connection region. The method further includes forming a housing that encloses the carrying substrate, electronic component, and electrical connector. The housing has a main surface and lateral surfaces. During the formation of the housing, the groove of the electrical connector is filled.
In addition to the power module, the patent also describes a device that includes a shell with internal surfaces, a cavity within the shell, a carrying substrate, an electronic component, and an electrical connector. The electrical connector extends towards one of the internal surfaces of the shell, is transverse to both internal surfaces, and is accessible from the outside of the shell. It also includes a groove that extends into the connector. The device further includes a gel material within the cavity, covering the carrying substrate and the side surface of the electrical connector.
Overall, this patent introduces a power module with a unique design and an assembling method for its production. The power module and device described in the patent offer improved functionality and accessibility due to the specific features of the electrical connector and housing.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
