Taiwan Semiconductor Manufacturing has been granted a patent for a package structure that includes a package substrate, two semiconductor packages, underfill material, a gap filling structure, and a heat dissipation structure. The components are designed to optimize thermal management and electrical bonding within the package. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Taiwan Semiconductor Manufacturing, 3D memory devices was a key innovation area identified from patents. Taiwan Semiconductor Manufacturing's grant share as of February 2024 was 71%. Grant share is based on the ratio of number of grants to total number of patents.

Package structure with underfill material, gap filling, and heat dissipation

Source: United States Patent and Trademark Office (USPTO). Credit: Taiwan Semiconductor Manufacturing Co Ltd

A recently granted patent (Publication Number: US11923259B2) discloses a package structure designed for efficient heat dissipation in semiconductor devices. The structure includes a package substrate with two semiconductor packages electrically bonded to it. An underfill material fills the spaces between the packages and the substrate, while a gap filling structure is placed laterally between the semiconductor packages, in contact with their sidewalls and the underfill material. Additionally, a heat dissipation structure, attached to the semiconductor packages through a thermal conductive layer, aids in heat management.

Furthermore, the patent details a method for forming the package structure, involving the sequential bonding of semiconductor packages to the substrate, filling of spaces with underfill material, and placement of the gap filling structure. The thermal conductive layer is then formed on top of the semiconductor packages, followed by the attachment of the heat dissipation structure. The design ensures efficient heat dissipation by maintaining a gap between the top surface of the gap filling structure and the thermal conductive layer, allowing for effective cooling. The method also includes specific steps for the formation of the thermal conductive layer and the positioning of the gap filling structure to optimize heat dissipation in the semiconductor devices.

To know more about GlobalData’s detailed insights on Taiwan Semiconductor Manufacturing, buy the report here.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.