Taiwan Semiconductor Manufacturing had one patents in 3D printing during Q4 2023. The patent filed by Taiwan Semiconductor Manufacturing Co Ltd in Q4 2023 relates to polishing pads with varying protrusions, where the central region has a greater hardness than the peripheral region. The polishing pad substrate also includes grooves adjacent to the protrusions. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degreee view of the company including its patenting strategy. Buy the report here.

Taiwan Semiconductor Manufacturing grant share with 3D printing as a theme is 0% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Polishing pad for chemical mechanical polishing and method (Patent ID: US20230398659A1)

The patent filed by Taiwan Semiconductor Manufacturing Co Ltd discloses polishing pads with varying protrusions, where the central region has a different hardness than the peripheral region. The pads also include grooves and pores of different dimensions and volume densities. Additionally, the method for polishing a wafer involves using polishing pads with specific width, height, and distance parameters between polishing structures to achieve optimal results.

Furthermore, the method for forming the polishing pads includes depositing different materials on the side surfaces of the protrusions, with varying hardness levels. The materials can be deposited using 3D printing or aerosol jet printing techniques. The pads may also contain hollow-containing polymers with different concentrations in the central and peripheral regions, affecting the volume of the hollows present. These innovative designs and manufacturing methods aim to enhance the efficiency and effectiveness of the polishing process for semiconductor wafers.

To know more about GlobalData’s detailed insights on Taiwan Semiconductor Manufacturing, buy the report here.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.