Taiwan Semiconductor Manufacturing had one patents in batteries during Q4 2023. The patent filed by Taiwan Semiconductor Manufacturing Co Ltd in Q4 2023 describes a semiconductor structure with a parallel connection of a diode-capacitor component and a battery structure. This structure can function as an energy harvesting device and energy storage structure, utilizing heat from nearby semiconductor devices or other heat sources. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degreee view of the company including its patenting strategy. Buy the report here.

Taiwan Semiconductor Manufacturing grant share with batteries as a theme is 0% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Energy harvest and storage device for semiconductor chips and methods for forming the same (Patent ID: US20230361057A1)

The patent filed by Taiwan Semiconductor Manufacturing Co Ltd describes a semiconductor structure that combines an energy harvesting device and an energy storage structure utilizing heat from adjacent semiconductor devices or other heat sources. The structure includes a parallel connection of a first component with a diode and a capacitor, and a second component with a battery structure. The capacitor can be a metal-ferroelectric-metal or metal-antiferroelectric-metal capacitor, while the diode consists of p-doped and n-doped semiconductor material layers.

The semiconductor structure also includes metal interconnect structures providing electrically conductive paths between the components, as well as a power source and switch for applying a DC bias voltage. Additionally, the structure comprises a layer stack with battery electrodes, an energy storage medium, a diode layer stack, and capacitor electrodes. The method of forming the semiconductor structure involves creating a layer stack on a substrate with specific components in a forward or reverse order, along with forming metal interconnect structures and dielectric layers over the substrate. The method also includes forming trenches in the substrate and electrically connecting different elements within the structure.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.