Taiwan Semiconductor Manufacturing had 104 patents in future of work during Q4 2023. The patents filed by Taiwan Semiconductor Manufacturing Co Ltd in Q4 2023 cover various techniques and apparatuses for polishing semiconductor substrates, monitoring filter efficiency in real time, determining wafer conditions during processing, calculating periods and pulse widths in a circuit, and a semiconductor structure with a biosensor and thermal management devices. These innovations aim to improve semiconductor manufacturing processes and device performance. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degreee view of the company including its patenting strategy. Buy the report here.

Taiwan Semiconductor Manufacturing grant share with future of work as a theme is 41% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Semiconductor processing tool and methods of operation (Patent ID: US20230411227A1)

The patent filed by Taiwan Semiconductor Manufacturing Co Ltd describes techniques and apparatuses for polishing the perimeter region of a semiconductor substrate to achieve a desired roll-off profile. The method involves depositing layers of oxide material, polishing the second layer using a chemical mechanical planarization tool with ring-shaped polishing pads, and adjusting rotational velocities based on feedback signals from a camera component. The tool includes multiple ring-shaped polishing pads rotating about orthogonal axes, with the controller adjusting rotational velocities and compressive forces to optimize the polishing process.

Furthermore, the patent includes claims for a chemical mechanical planarization tool with specific components and functionalities, such as adjusting rotational velocities of polishing pads, controlling compressive forces, and utilizing machine-learning models to estimate roll-off profiles. The method outlined in the patent involves forming layers of different materials on the semiconductor substrate, rotating the substrate, and removing specific thicknesses of material using ring-shaped polishing pads. The method also specifies the dimensions of the perimeter region to be polished and excludes the removal of the first layer of material during the polishing process.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.