Taiwan Semiconductor Manufacturing had one patents in internet of things during Q4 2023. The patent describes methods for preparing a void-free protective coating for a dielectric window used in a plasma treatment tool. This involves applying a first protective coating layer, polishing it to fill in any voids, and then applying a second protective coating layer to achieve a void-free coating. This process aims to increase the process uptime and service lifetime of the window and tool. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degreee view of the company including its patenting strategy. Buy the report here.

Taiwan Semiconductor Manufacturing grant share with internet of things as a theme is 0% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Methods for preparing void-free coatings for plasma treatment components (Patent ID: US20230367339A1)

The patent filed by Taiwan Semiconductor Manufacturing Co Ltd. discloses methods for preparing a void-free protective coating for a dielectric window used in a plasma treatment tool. The protective coating involves applying a first layer, polishing it to create a flat surface, and then adding a second layer to achieve a void-free coating. This innovation aims to enhance the process uptime and service lifetime of the dielectric window and the plasma treatment tool, ultimately improving overall efficiency and performance.

The claims associated with the patent detail the specific components and characteristics of the plasma treatment tool, such as the materials used for the dielectric window, the protective coating composition, and the dimensions of the uncoated annular retreat area. Additionally, the method for plasma treating a semiconducting wafer substrate using the described protective coating is outlined, emphasizing the importance of the void-free coating's thickness, surface roughness, hardness, and crystallinity. By incorporating a two-layer protective coating system, the patent introduces a novel approach to ensuring the durability and effectiveness of the dielectric window in plasma treatment applications, potentially setting a new standard for the industry.

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