Taiwan Semiconductor Manufacturing had 20 patents in robotics during Q4 2023. The patents filed by Taiwan Semiconductor Manufacturing Co Ltd in Q4 2023 focus on improving wafer processing efficiency and quality. This includes systems for determining wafer conditions during processing, a semiconductor structure manufacturing system with multiple chambers and robots for wafer transportation, a method for reducing thickness variation in spin-on coating layers, a semiconductor apparatus with edge detection capabilities, and a transfer blade designed to avoid contact with sensitive areas of a workpiece. GlobalData’s report on Taiwan Semiconductor Manufacturing gives a 360-degreee view of the company including its patenting strategy. Buy the report here.

Taiwan Semiconductor Manufacturing grant share with robotics as a theme is 40% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.

Recent Patents

Application: Wafer process monitoring system and method (Patent ID: US20230411190A1)

The patent filed by Taiwan Semiconductor Manufacturing Co Ltd. describes a system and method for determining the condition of wafers during processing. The system involves detecting vibrations of a wafer transfer robot, generating signals based on these vibrations, and processing the signals to assess the condition of the wafers held by the robot. The system includes components such as a wafer lift, vibration sensor, wafer count sensor, and a processing module with memory to store signal patterns for analysis.

The system's claims detail the configuration of the components, including the use of inertial-based motion detectors, accelerometers, and gyroscopes in the vibration sensor. It also mentions the inclusion of an optical sensor for capturing images, a monitor for displaying alerts based on the condition of the wafers, and specific features like slots in the robot arms to hold the wafers securely. The method outlined in the patent involves detecting vibrations, counting the number of wafers held, processing signals and images to determine the condition of the wafers, which could include being cracked, broken, held incorrectly, or missing. Overall, the patent aims to improve the monitoring and assessment of wafer conditions during processing using a comprehensive system and method.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.