TDK had one patents in metaverse during Q2 2024. The patent filed by TDK Corp in Q2 2024 is for a high-frequency coil component that includes a sealing portion with resin and hollow particles, and a coil portion made of conductive wire. The resin used has a low dielectric constant and specific proportions of resin to hollow particles are maintained for optimal performance. GlobalData’s report on TDK gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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TDK had no grants in metaverse as a theme in Q2 2024.

Recent Patents

Application: High-frequency coil component (Patent ID: US20240128018A1)

The patent filed by TDK Corp describes a high-frequency coil component that includes a sealing portion with a resin and hollow particles, along with a coil portion made of wound conductive wire. The resin contains a low-dielectric resin with a specific relative permittivity range at 23±2° C. The ratio of the mass of the resin to the total mass of hollow particles must fall within a specified range to meet the criteria outlined in the patent.

Furthermore, the patent includes specific claims related to the relative permittivity of the sealing portion, the type of low-dielectric resin used (such as thermosetting polyimide), and the composition of the hollow particles (e.g., glass). The volume ratio of the resin to the hollow particles is also defined within certain limits. These claims provide additional details and specifications regarding the high-frequency coil component described in the patent, ensuring the uniqueness and novelty of the invention.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.