Zhen Ding Technology. has filed a patent for a circuit board assembly featuring a core layer with accommodating space, shielding ring walls, circuit layers, insulating layers, and shielding columns. The design aims to enhance electronic component protection and functionality within the assembly. GlobalData’s report on Zhen Ding Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Zhen Ding Technology, Under-screen biometric identification was a key innovation area identified from patents. Zhen Ding Technology's grant share as of January 2024 was 50%. Grant share is based on the ratio of number of grants to total number of patents.

Circuit board assembly with shielding ring walls and columns

Source: United States Patent and Trademark Office (USPTO). Credit: Zhen Ding Technology Holding Ltd

The patent application (Publication Number: US20240040687A1) describes a circuit board assembly with innovative features aimed at improving electronic component performance and protection. The assembly includes a core layer with accommodating spaces for electronic components, shielded by first and second shielding ring walls to prevent interference. Additionally, the inclusion of shielding columns and layers further enhances the protection and isolation of the components, ensuring optimal functionality.

Furthermore, the design incorporates advanced elements such as multiple metal layers and a conductive material in the second shielding ring wall, along with a graphene layer surrounding the electronic components. These features not only provide enhanced shielding but also ensure electrical isolation between the components and the shielding structures. The use of photosensitive dielectric material for the core layer and the strategic placement of insulating layers contribute to the overall efficiency and performance of the circuit board assembly. Overall, the patent application showcases a comprehensive approach to circuit board design, focusing on both functionality and protection of electronic components in a compact and efficient manner.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.