Advantest. has filed a patent for a testing system with liquid-cooled thermal arrays that pivot in three dimensions, ensuring even contact and improving thermal performance. This innovation allows for testing more devices simultaneously in a smaller space, reducing costs, and enhancing cooling capacity for high-powered devices. GlobalData’s report on Advantest gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Advantest, NFC-enabled implants was a key innovation area identified from patents. Advantest's grant share as of January 2024 was 36%. Grant share is based on the ratio of number of grants to total number of patents.

Liquid cooled thermal arrays for testing devices under test

Source: United States Patent and Trademark Office (USPTO). Credit: Advantest Corp

A recently filed patent (Publication Number: US20240036104A1) describes a test system designed for testing devices under test (DUT). The system includes a test interface board (TIB) and a socket interface board (SIB) with a gimbal mount that securely fixes the SIB to the TIB. The SIB features a socket to receive the DUT and a thermal array to regulate the temperature of the DUT during testing. Additionally, a superstructure surrounds the DUT when placed in the socket, with an interposer in contact with the DUT to enhance the testing process.

Furthermore, the patent details various configurations and components of the test system, such as a self-actuating socket (SAS) and parallel socket actuation (PSA) socket. The system can accommodate multiple DUTs simultaneously, with gimbal mounts aligning the DUTs with the thermal array for efficient testing. The thermal array itself comprises a gimbal mount, a thermal head, and a fixed tray with a socket for housing the DUT. The thermal head can pivot freely in three dimensions to ensure optimal contact with the DUT for precise temperature regulation during testing. Overall, the patent outlines a comprehensive test system with innovative features to enhance the testing process for electronic devices.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.