Diodes has filed a patent for a leadframe design for a semiconductor package. The leadframe includes a rectangular die attach pad surrounded by multiple lead pads. The die attach pad has protruding portions on each side, each coupled to a lead pad. The leadframe also includes additional lead pads on both sides of the protruding portions. The design allows for bonding wires to connect the IC die’s active signals to the lead pads. GlobalData’s report on Diodes gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Diodes, Authentication communication protocols was a key innovation area identified from patents. Diodes's grant share as of September 2023 was 68%. Grant share is based on the ratio of number of grants to total number of patents.
A leadframe for a semiconductor package with improved connections
A recently filed patent (Publication Number: US20230317567A1) describes a semiconductor package that includes a leadframe with a rectangular die attach pad surrounded by multiple lead pads. The die attach pad has protruding portions on both sides, each coupled to a lead pad. A semiconductor integrated circuit (IC) die is attached to the die attach pad, which provides electrical ground for the lead pads. Bonding wires are used to connect the IC die's bonding pads for active signals to the lead pads on both sides of the die attach pad.
The patent also mentions that the leadframe may include a peripheral frame connected to the lead pads, but the die attach pad does not have a direct connection to the peripheral frame. Additionally, the die attach pad can have additional protruding portions on either side of the main protruding portions, each coupled to a respective lead pad. The die attach pad can also have a rectangular shape with a length longer than its width, and in this case, it includes a third protruding portion on one side and a fourth protruding portion on the opposite side, each coupled to a lead pad.
The semiconductor package may further include a molding that covers parts of the leadframe, die attach material, and the die, leaving a portion of the die attach pad and lead pads exposed. The active signals mentioned in the patent can include control signals and data signals.
In addition to the semiconductor package, the patent also describes a leadframe that includes a peripheral frame and multiple lead pads connected to the frame. The leadframe has a rectangular die attach pad surrounded by the lead pads, with protruding portions on both sides of the die attach pad, each coupled to a lead pad. Similar to the semiconductor package, the die attach pad may have additional protruding portions on either side and can have straight or curved edges.
The patent also outlines a method for forming the semiconductor package, which involves attaching an IC die to the die attach pad, bonding the IC die's bonding pads for active signals to the lead pads on both sides of the die attach pad, applying a molding to cover the package, and separating the lead pads from the peripheral frame.
Overall, this patent describes a semiconductor package design and a method for its formation, providing specific details about the structure and configuration of the leadframe, die attach pad, and lead pads.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
