Foxconn Technology has filed a patent for a high-temperature radiator that improves heat dissipation efficiency for server chips. The radiator includes radiating pipes, heat conducting tubes, an aluminum radiating plate, and heat sinks. The design aims to meet the heat dissipation requirements of higher chip power. GlobalData’s report on Foxconn Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Foxconn Technology, data center cooling systems was a key innovation area identified from patents. Foxconn Technology's grant share as of September 2023 was 59%. Grant share is based on the ratio of number of grants to total number of patents.
A radiator for dissipating heat generated by a chip

A recently filed patent (Publication Number: US20230232576A1) describes a radiator designed to dissipate heat generated by a server chip. The radiator consists of several components, including first radiating pipes with embedded heat conducting tubes and an aluminum radiating plate. A first heat sink is positioned on one side of the first radiating pipe, while a second heat sink is connected to the other end.
In claim 2, the patent mentions the inclusion of a copper radiating plate positioned between the first radiating pipe and the first heat sink. Claim 3 states that the first heat sink is equipped with spaced-apart dissipation fins, which are perpendicular to the aluminum radiating plate. Similarly, claim 5 describes the second heat sink as having dissipation fins positioned on a supporting plate, also perpendicular to it.
The patent further explains in claim 7 that the first and second ends of the radiator are perpendicular to each other, with the second end extending through the second dissipation fins and spaced from the supporting plate. Claim 9 specifies that the cross-section of the first end is rectangular and that post-processing techniques such as roller processing and/or CNC processing may be applied to it.
In claim 11, an alternative embodiment of the radiator is presented, which includes a second radiating pipe embedded in the first heat sink and attached to the aluminum radiating plate. This embodiment also features bent portions connecting the third and fourth ends of the second radiating pipe, with the fourth end extending through the first dissipation fins and spaced from the aluminum radiating plate.
The remaining claims (13-19) provide additional details about the configuration of the first and second heat sinks, including the presence of depression and sleeving portions in the first dissipation fins to accommodate the second radiating pipe and the fourth end.
Overall, this patent describes a radiator design specifically tailored for dissipating heat generated by server chips. The inclusion of various components, such as radiating pipes, heat conducting tubes, and dissipation fins, along with the use of different materials like aluminum and copper, contribute to the efficient cooling of the chip. The patent also presents an alternative embodiment with a second radiating pipe for enhanced heat dissipation.
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