IBIDEN has been granted a patent for an inductor built-in substrate. The substrate includes a core substrate with an opening, a magnetic resin body filled with magnetic resin in the core substrate’s opening, and a plating film with an electrolytic plating film formed in the through hole of the magnetic resin body. The patent also includes various plating film structures and a through-hole land. GlobalData’s report on IBIDEN gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on IBIDEN, Diesel Particulate Filters (DPF) was a key innovation area identified from patents. IBIDEN's grant share as of September 2023 was 27%. Grant share is based on the ratio of number of grants to total number of patents.
Inductor built-in substrate with magnetic resin and plating film
A recently granted patent (Publication Number: US11763975B2) describes an inductor built-in substrate and a method for manufacturing it. The inductor built-in substrate includes a core substrate with an opening and a first through hole. A copper foil is formed on the core substrate, and a first plating film structure is formed in the first through hole. The substrate also includes a magnetic resin body filled in the opening of the core substrate, with a second through hole. A second plating film structure is formed in the second through hole of the magnetic resin body, and an electrolytic plating film is in contact with the magnetic resin body. A through-hole land with a third plating film structure is formed on the surface of the magnetic resin body, extending over the opening of the second through hole. The first plating film structure includes an electroless plating film in contact with the core substrate, and the third plating film structure includes a plating film that extends on the end portion of the magnetic resin body and the copper foil, with a thicker plating film on the copper foil compared to the end portion of the magnetic resin body.
The method for manufacturing the inductor built-in substrate involves several steps. First, an opening is formed in a core substrate made of a copper-clad laminated plate with a copper foil. A magnetic resin is filled in the opening to form a magnetic resin body. A second through hole is formed in the magnetic resin body. A first electrolytic plating film is formed on the surfaces of the core substrate and the end portions of the magnetic resin body, creating a second plating film structure inside the second through hole. A first electroless plating film is formed inside the first through hole of the core substrate, in contact with the core substrate. A second electrolytic plating film is formed on the first electroless plating film. A through-hole land with a third plating film structure is formed on the end portion of the magnetic resin body, extending over the opening of the second through hole. The third plating film structure includes a plating film that extends on the end portion of the magnetic resin body and the copper foil, with a thicker plating film on the copper foil compared to the end portion of the magnetic resin body.
This patented technology provides an improved design for an inductor built-in substrate, which can be used in various electronic devices. The use of different plating film structures and the inclusion of a magnetic resin body with an iron filler contribute to the enhanced performance of the inductor built-in substrate. The manufacturing method outlined in the patent allows for efficient production of the substrate with precise control over the plating film thickness and the formation of circuit patterns. Overall, this patent introduces advancements in the field of inductor built-in substrates, offering potential benefits for electronic device manufacturers.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
