Seiko Epson. has filed a patent for an injection molding device with a housing, injection molding machine, detection section, and control section. The device controls mold clamping and opening by moving components vertically and stops operation if the door is open or foreign matter is detected. GlobalData’s report on Seiko Epson gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Seiko Epson, E-transaction user interfaces was a key innovation area identified from patents. Seiko Epson's grant share as of January 2024 was 32%. Grant share is based on the ratio of number of grants to total number of patents.
Injection molding device with safety features for mold clamping
The patent application (Publication Number: US20240033985A1) describes an injection molding device with innovative features aimed at enhancing operational efficiency and safety. The device includes a housing with a door, an injection molding machine, a detection section to monitor the door status and detect foreign matter intrusion, and a control section. The injection molding machine comprises a support section for die-casting molds, an injection unit, and a mold clamping device. The control section manages the mold clamping process by controlling voltage to the mold clamping motor based on the door status or foreign matter detection.
Furthermore, the injection molding device incorporates additional elements such as an ejector section for removing molded articles, a heating section in the injection unit, and a plasticizing section with a unique design. The device also features a position change section to switch between different supported states for the lower molds. Additionally, the device includes multiple ejector sections with ejector pins and motors strategically located below the support section. The control section also manages the movement of a movable pin in the cavity in conjunction with the ejector section's operation. These innovative features aim to improve the overall functionality and safety of the injection molding device, making it a promising solution for manufacturing processes requiring precision and reliability.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
