Everspin Technologies has been granted a patent for a method of manufacturing a magnetoresistive device with a unique structure involving two dielectric layers and a free magnetic layer. The process includes multiple etch and encapsulation steps to create the desired configuration. GlobalData’s report on Everspin Technologies gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Everspin Technologies, In-memory computing was a key innovation area identified from patents. Everspin Technologies's grant share as of February 2024 was 68%. Grant share is based on the ratio of number of grants to total number of patents.
Magnetoresistive device manufacturing method with encapsulation layer
A recently granted patent (Publication Number: US11925122B2) discloses a method for manufacturing a magnetoresistive device. The method involves forming a stack comprising a first electrode, a free magnetic layer, two tunnel barrier layers, and a second electrode. The process includes etching a portion of the stack to expose a surface above the first electrode, forming an encapsulation layer on the exposed surface, and selectively etching to expose the first tunnel barrier layer. The encapsulation layer can be deposited on the sidewalls and in contact with the first surface, providing protection and stability to the device.
Furthermore, the method includes variations such as using specific materials for the encapsulation layer, including aluminum, silicon nitride, silicon oxide, magnesium, or a combination thereof. The patent also mentions the configuration of the electrodes, with the second electrode being non-ferromagnetic in some embodiments. Additionally, the method details the formation of the encapsulation layer on the sidewalls and in contact with the first surface, ensuring comprehensive coverage and protection for the magnetoresistive device. Overall, the patent outlines a detailed process for manufacturing a magnetoresistive device with improved encapsulation and electrode configurations for enhanced performance and durability.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
