Inventec‘s patented fixing device comprises a circuit board, first cover with a bump, reinforcing piece, and double-layer chip. The chip’s upper and lower layers are connected, with the lower layer linked to the circuit board. The device includes a second cover with heat dissipation structures. GlobalData’s report on Inventec gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Inventec, Data center cooling systems was a key innovation area identified from patents. Inventec's grant share as of February 2024 was 58%. Grant share is based on the ratio of number of grants to total number of patents.
Fixing device with double-layer chip for circuit board
A recently granted patent (Publication Number: US11924989B2) discloses a fixing device designed with innovative features to enhance thermal management in electronic devices. The device comprises a circuit board with openings, a first cover with a bump, a second cover with heat dissipation structures, and a reinforcing piece with fixing portions. A double-layer chip is electrically connected to the circuit board, with the upper layer in contact with the first cover and the lower layer in contact with the second cover, ensuring efficient heat dissipation.
The patent further details various configurations and enhancements to the fixing device, such as the reinforcing piece being fully attached to the first surface, the positioning of the first bump between fixing portions, and the embedding of the upper layer of the double-layer chip into the opening. Additionally, the use of thermal conductive material in the bumps ensures effective heat transfer. These features collectively contribute to improved thermal performance and stability in electronic devices, making the fixing device a valuable innovation in the field of electronic component assembly and heat management.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
