Inventec has been granted a patent for a heat dissipation device featuring a housing with opposing sidewalls, a heat dissipation plate, and multiple fans. The design includes strategically placed openings and airflow directions to enhance heat management for at least one heat source within the device. GlobalData’s report on Inventec gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Inventec, Data center cooling systems was a key innovation area identified from patents. Inventec's grant share as of July 2024 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Heat dissipation device with multiple fans and openings
The granted patent US12075594B2 presents a novel heat dissipation structure designed to enhance thermal management in various applications. The structure features a housing with opposing sidewalls, each equipped with designated opening areas. A heat dissipation plate is positioned within the housing to cover at least one heat source, incorporating an opening that aligns with the first opening area. The design includes a first fan located within this opening and at least two additional fans situated near the heat dissipation plate, with their airflow exits oriented away from the first fan. The housing is further characterized by multiple side surfaces that connect the sidewalls, featuring three side opening areas that direct airflow in different orientations.
Additional claims detail the construction and functionality of the heat dissipation plate, which includes thermal conductive components extending through the airflow exits of the second fans. The design also incorporates brackets and thermal exchangers to optimize airflow and thermal exchange between the fans and the heat sources. The structure allows for the separation of multiple heat sources and includes various baffles to manage airflow effectively. The arrangement of the opening areas and the positioning of the fans are strategically designed to enhance the overall efficiency of heat dissipation, making this patent relevant for applications requiring effective thermal management solutions.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
