Knowles has patented a sensor package with a unique design, including multiple layers and an inductor configured as a single layer trace. The package features a transducer with a diaphragm and back plate, along with a sound port passing through all layers of the substrate. GlobalData’s report on Knowles gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Knowles, was a key innovation area identified from patents. Knowles's grant share as of February 2024 was 48%. Grant share is based on the ratio of number of grants to total number of patents.
Mems sensor package with inductor and transducer
A recently granted patent (Publication Number: US11912564B2) discloses a microelectromechanical systems (MEMS) sensor package that includes a substrate with multiple layers, a transducer, and an inductor. The inductor is configured as a single layer trace on an inductor layer within the substrate, positioned between specific layers within the substrate. The transducer consists of a diaphragm and a back plate, with the substrate housing a sound port acoustically connected to the diaphragm. Notably, the design ensures no other inductors are present between layers in a direction perpendicular to the plane of the inductor layer, with the sound port passing between traces of the inductor.
Furthermore, the patent details additional features of the MEMS sensor package, such as the inclusion of a capacitor electrically coupled to the inductor, a capacitor physically located within the substrate, and an application-specific integrated circuit connected to the substrate. The configuration of the inductor, capacitor, and integrated circuit within the sensor package is meticulously described, emphasizing the specific electrical connections and contacts between these components. The patent also highlights the presence of solder pads and the strategic placement of the inductor adjacent to these pads, showcasing a comprehensive and innovative design approach in the development of sensor packages.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
